YUESHAN supplies PCB drilling consumables to Philippine semiconductor and EMS lines: 1100 H18 aluminum entry boards in 0.15–0.28 mm selected by drill diameter, lubricant-coated entry aluminum for sub-Ø0.15 mm microvia, and backup boards from HDF 880 (75±2 HD) to Phenolic PHE (90±5 HD, decomposition above 220 °C). A Singapore-registered trading partner has bought 1100 H18 × 0.18 mm entry aluminum from YUESHAN continuously since 2017 — material that serves an OSAT plant in the Philippines itself. Sheets 940 × 1245 mm and 520 × 620 mm, MOQ 100–200 sheets, free samples with TDS/MSDS, FOB/CIF to Manila.
The Philippines is one of the densest OSAT (outsourced assembly and test) concentrations in the world, centred on CALABARZON south of Manila and Clark to the north. Packaging and test lines drill fine-pitch substrate and lead-frame work where a single burr or stub defect can scrap a packaged part. That makes the backup board and entry board a qualified material, not a commodity. This page maps YUESHAN's configuration to the clusters that actually drill in the Philippines.
Luzon holds more than 70% of the Philippines' operating semiconductor floor space. CALABARZON — Cavite, Laguna, Calamba and Binan — is the core hub: Texas Instruments' Clark site ships several billion analog units a year, STMicroelectronics' Calamba campus employs more than 4,000, and Amkor runs multiple OSAT plants in the country (including Binan, Laguna and Muntinlupa). ASE expanded in 2024 through its acquisition of Infineon's Cavite backend line, and Samsung Electro-Mechanics is building a PHP 50.65 billion greenfield auto-capacitor plant starting 2027.
Sources: Mordor Intelligence Philippines Semiconductor Market report; Amkor company disclosures, 2024–2027. These are industry-context facts. YUESHAN does not claim any of these companies as customers.
Fine-pitch substrate and lead-frame drilling demands the hardest, flattest support: Phenolic PHE at 90±5 HD, 1.50 mm, decomposition above 220 °C, paired with lubricant-coated entry aluminum for sub-Ø0.15 mm microvia. See HDI & IC substrate solutions.
Analog and power IC in high volume: HDF 880 (75±2 HD) for the base multilayer load, UV Melamine 950 where positional tolerance tightens.
New-product-introduction and short runs punish inconsistent material; UV Melamine 950 gives a repeatable exit surface across changeovers without re-tuning every job.
Thick-copper automotive PCB wears bits fast; HDF 880 or UV Melamine 880 with back-drill aluminum for stub control — see automotive PCB solutions.
| Build type | Entry material | Recommended backup | Why |
|---|---|---|---|
| IC substrate / interposer (OSAT) | 1100 H18 · 0.15–0.20 mm | Phenolic PHE · 90±5 HD | Highest hardness on the range; holds face above 220 °C substrate-drilling heat |
| HDI 1–2 step, sub-Ø0.15 mm microvia | Lubricant-coated aluminum (LCO) | UV Melamine 950 · 83±3 HD | Coating cools and lubricates the bit; sealed hard face holds microvia location |
| 12–24 L / back-drill | 1100 H18 · 0.20–0.28 mm | UV Melamine 980 + back-drill aluminum | Anti-deformation at tall stack; controlled stub depth |
| High-volume multilayer 4–12 L | 1100 H18 · 0.18–0.25 mm | HDF 880 · 75±2 HD | Best published cost-to-performance for CALABARZON base load |
| Automotive PCB (thick copper) | 1100 H18 · 0.20–0.25 mm | HDF 880 or UV Melamine 880 | Cuts bit wear on thick copper, holds burr low |
| Flexible / thin panels | Thin 1100 H18 | UV Melamine 840 or kraft paper | Sealed melamine face resists the tropical humidity |
The entry board sits on top of the panel stack: it positions the drill on entry, stops the bit skating and — coated types — cools the bit. The backup board sits under the stack and supports the hole exit so glass fibre and copper are sheared clean instead of torn, which is the basis of exit-burr control and fewer broken bits. They are not interchangeable; a complete line needs both. New to this? Read what an entry board does and what a backup board does.
| Drill Ø (mm) | Recommended entry thickness (mm) |
|---|---|
| 0.20–0.25 | 0.15–0.20 |
| 0.30–0.35 | 0.18–0.25 |
| 0.40–0.45 | 0.20–0.28 |
Plain 1100 H18 covers holes of Ø0.15 mm and larger on multilayer and PTH work. Below Ø0.15 mm switch to LCO lubricant-coated entry aluminum. Background in the HDI drilling guide.
Metro Manila and Cavite relative humidity routinely exceeds 80% for months. A wood-based backup board that absorbs moisture softens at the face — and the symptom shows exactly at the hole exit: more burr, less flatness, compressed stack height. It is the most overlooked cause of seasonal burr spikes.
Procedure detail is in the backup-board moisture guide; for cracked boards after drilling see backup-board snapping.
| Grade | Hardness | Thickness | Best for |
|---|---|---|---|
| HDF 840 | ~70 HD | 2.0 / 2.5 mm | 2–4 L, cost-first |
| HDF 880 | 75±2 HD | 2.0 / 2.5 mm | Standard 2–12 L |
| UV Melamine 880 | 80±3 HD | 2.0 / 2.5 mm | HDI 1–2 step · 12–24 L |
| UV Melamine 950 | 83±3 HD | 2.5 mm | HDI microvia, tighter tolerance |
| UV Melamine 980 | 80±5 HD | 2.5 mm | Back-drill · high layer count |
| Phenolic PHE | 90±5 HD | 1.50 mm | IC substrate / routing table |
| Sheet size (mm) | Sheets / pallet | MOQ (sheets) |
|---|---|---|
| 940 × 1245 | 300 | 100 |
| 520 × 620 | 800 | 200 |
Cut-to-panel-size is available. Every lot ships with TDS and MSDS/SDS; COA by batch on request. Check load and stack height with the stack height calculator before a first order.
Full account in the Singapore trading-partner case study; material data in the 1100 H18 spec sheet. For the pricing mechanism, see how aluminum formula pricing works.
Reference: how to choose a backup board, multilayer drilling, back-drilling principle.
Comparing regional markets? See the Southeast Asia hub or the country pages for Malaysia, Singapore and Vietnam.
Contact Mr. Lucky Xu — WhatsApp +86 13433290964, email henan_xu@hotmail.com, or use the contact form. Include layer count and smallest hole (or alloy/thickness), panel size and monthly volume.
Yes. A Singapore-registered trading partner has bought 1100 H18 aluminum entry board at 0.18 mm from YUESHAN continuously since 2017, and the documented end user is a semiconductor OSAT plant in the Philippines. Multiple 2025 shipments closed with no quality claim.
Phenolic PHE — 90±5 HD, 1.50 mm, decomposition above 220 °C. It is the hardest grade in the range and holds its face under substrate drilling heat. Pair it with 1100 H18 entry at 0.15–0.20 mm.
By drill diameter. Ø0.20–0.25 mm holes use 0.15–0.20 mm entry; Ø0.30–0.35 mm use 0.18–0.25 mm; Ø0.40–0.45 mm use 0.20–0.28 mm. Standard alloy and temper is 1100 H18.
Plain 1100 H18 is adequate for holes of Ø0.15 mm and above on multilayer and PTH work. Below Ø0.15 mm — HDI microvia, BGA, IC substrate — use lubricant-coated (LCO) entry, because the coating cools and lubricates the bit.
TDS and MSDS/SDS with every shipment, and COA by batch on request. Every lot goes through pre-shipment self-inspection — what an OSAT line needs for qualified, traceable material.
No. Aluminum entry board is quoted on a formula basis: SMM spot aluminum plus a processing surcharge, disclosed before order confirmation. A 2026 order from our Singapore partner triggered a roughly 9% formula adjustment, communicated in advance.
Two standard sizes: 940 × 1245 mm (300 sheets per pallet, MOQ 100 sheets) and 520 × 620 mm (800 sheets per pallet, MOQ 200 sheets). Cut-to-panel-size is available.
Free samples ship in 3–5 days with TDS/MSDS. Production orders are typically 2–3 weeks on FOB or CIF terms to Manila (or Clark via Subic).
Yes. Back-drill aluminum is supplied for controlled-depth drilling and stub control on high layer count and high-reliability boards, usually alongside UV Melamine 980 backup.
Contact Mr. Lucky Xu via WhatsApp (+86 13433290964) or email henan_xu@hotmail.com with layer count and smallest hole for backup, or alloy and thickness for entry, plus panel size and monthly volume.