Stop searching by material name. Start by what you actually drill. Each application below opens the proven backup, entry and back-drill combination — tuned to cut burr, extend tool life and hold stub control.
YUESHAN PCB drilling material solutions map each application to a proven backup, entry and back-drill combination tuned to cut burr, extend tool life and hold stub control. Instead of searching by material name, pick your board type, 5G/server, HDI/IC, medical or military, and get the validated grade set plus a free sample kit.
Each proven stack is an application-specific consumable combination validated for a target board type and drill program.
Pick your application. Each page shows the recommended material set, the grade matrix and a free sample kit.
Precision drilling materials for microvias below Ø0.15 mm and IC substrates.
Explore HDI & IC Substrate →Reliable drilling consumables for long-life, harsh-environment automotive boards.
Explore Automotive PCB →Back-drilling and drilling materials for high-speed digital signal integrity.
Explore 5G & Server →Traceable, high-reliability drilling materials for defense and aerospace PCB.
Explore Defense & Aerospace →Fine-feature, clean drilling materials for medical and diagnostic PCB.
Explore Medical & Diagnostic →Send your layer count, smallest hole and current material. We return a matched grade set, samples and a side-by-side comparison — usually within one business day.
Talk to Mr. Lucky Xu →Our material-to-board matching starts from your board thickness stackup and drill parameter alignment, then returns a stack recommendation tuned to your yield target.
Three parameters decide the right backup, entry and back-drill combination. Give us these and we return a matched grade set.
2–12 layer boards run on HDF or melamine backup. 14+ layers and fine-pitch HDI push toward UV-melamine and coated entry. Thicker stacks also need a stiffer entry sheet.
Through-holes above Ø0.20 mm suit plain aluminum entry. Sub-Ø0.15 mm microvias need coated / lubricant aluminum with a thin base for location accuracy.
High-speed 5G and server channels need back-drilling for stub control. We pair the back-drill sheet with a compatible entry so stub CpK holds across lots.
We start from the board, not the material name. For example, a 10-layer automotive control board maps to HDF or melamine backup with a 0.18 mm 1100 H18 aluminum entry board, while a sub-Ø0.15 mm HDI & IC substrate moves to coated aluminum and premium melamine. Send your stack and we return samples — usually within one business day. Talk to Mr. Lucky Xu →
If your smallest hole is below Ø0.15 mm or you run IC substrates, you need coated / lubricant aluminum and premium melamine backup. Standard multilayer above Ø0.20 mm runs on plain entry with HDF or melamine. The HDI & IC substrate solution details the set.
Yes. Our consumables are supplied to ISO 9001:2015 with SGS, REACH and UL documentation, and we provide lot-level CpK reports for traceability on automotive and defense lines.
Partly. Entry and backup grades overlap, but back-drilling is specific to high-speed channels. We can qualify a shared base set and add a back-drill sheet for the 5G line — see the 5G & server solution.
Send layer count, smallest hole and current material. We return a matched grade set, samples and a side-by-side comparison — usually within one business day. Get a Quote →