In 2025 India approved 7 new electronics-component plants under the ECMS scheme, with about 5,532 crore rupees (roughly 660 million USD) invested and layer-count capability up to 24 layers, aimed at 20% of domestic PCB demand. This localization wave is a major opening for local drilling-material and coated entry sourcing.

India is building its PCB manufacturing capacity at unprecedented speed — and the implications for drilling material suppliers are significant.
In 2025, India approved 7 new electronics component manufacturing plants under the ECMS (Electronics Component Manufacturing Scheme), with a total investment of approximately ₹5,532 crore (~$660M USD).
Key approved projects include HDI and multilayer plants in Hosur, Tamil Nadu, and other locations, with layer-count capabilities up to 24 layers. These new facilities are expected to satisfy 20% of India's domestic PCB demand — reducing the country's 88% import dependency.
India's PCB market is currently estimated at $5-7.3 billion (2025), growing at 15-17% CAGR. But the product mix is shifting:
Current state:
Post-ECMS (2026-2028):
India's manufacturing environment presents a specific challenge: high humidity. Manufacturing clusters in Bangalore, Gujarat, and Pune regularly experience >65% relative humidity. Standard HDF backup boards absorb moisture and warp, causing flatness deviations, drill bit breakage and stack alignment problems.
UV Melamine coated boards address this directly: the UV-cured surface acts as a moisture sealant, preventing warp. This isn't a marketing claim — it's been proven by Indian PCB manufacturers who eliminated warp-related scrap after switching to UV-grade backup boards. See our backup board selection guide for more detail.
For drilling material suppliers, India's ECMS-driven expansion means:
The new ECMS plants begin production in 2026-2027. Material qualification cycles typically run 6-12 months. The window to establish relationships with these new facilities is now — before they default to existing supply chains.