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HDI & IC Substrate Drilling

HDI IC substrate PCB drilling application scene

Precision drilling materials for microvias below Ø0.15 mm and IC substrates.

HDI and IC-substrate drilling pushes hole location and exit quality to the limit with microvias below 0.15 mm. The winning stack is a coated entry plus a graded melamine or phenolic backup that holds microvia registration tight and exit burr under control across high-layer-count, fine-pitch builds.

HDI and IC substrate boards push hole location and exit quality to their limit. The right stack — a coated entry plus a graded melamine or phenolic backup — is what keeps microvia registration tight and exit burr under control.

UV Melamine backup board for HDI and IC substrate drilling
Recommended Material Stack

The Combination We Recommend

Each grade below is matched to the hole size, layer count and reliability target of HDI & IC Substrate boards. Tap any card for specs and a free sample.

Lubricant / Coated Aluminum (green thermoset-coated)

★ RecommendedThermoset 220°C film · default

Our default entry — stable film, no hole-halo on dense IC/HDI microvias; a direct thermoset-coated alternative.

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UV Melamine 950

★ RecommendedHDI main backup · default

Anti-warp, ~20% below melamine-laminate cost — our recommended default for most HDI lines.

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Phenolic PHE

Specialty

Kept for routing worktables and specific IC jobs — available on request, not our primary push.

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The challenge on HDI lines

Microvias are drilled at high rpm into very thin dielectric. A few microns of drift and the via misses the target pad. Exit burr, even at 20 µm, breaks the electrical connection on the next layer.

Three failure modes dominate:

  • Location drift — the bit walks on entry, the via lands off-pad.
  • Exit burr — smeared copper at the hole bottom, caught only at electrical test.
  • Resin smear — soft backup transfers resin into the hole wall and hurts plating.

Why the material stack decides the result

The entry board sets the bit. A coated aluminum first-entry holds the drill on centre and pulls heat away, so the first 0.1 mm is dead straight. The backup board then controls the exit: a dense, smooth-faced phenolic or UV melamine backs the hole so the last fibre breaks clean.

With the matched set we typically see:

  • Hole location held within ±25 µm on Ø0.10–0.15 mm vias
  • Exit burr reduced to ≤0.05 mm, often below the AOI threshold
  • Resin smear low enough that mild desmear restores the wall

Grade matrix

Board Grade Best for Exit burr
Lubricant Alu Green thermoset-coated (thermoset 220°C) Sub-Ø0.15 mm vias, HDI 1–2 step — (entry, default)
Backup UV Melamine 950 Standard HDI, 1–2 step microvia ≤0.05 mm (default)
Backup Phenolic PHE Specialty — IC substrate / routing Available on request

Services that shorten your evaluation

Free samples of the full HDI set are shipped in 5–7 days. A one-page comparison against your current supplier grade is returned with the samples. DFM advice in English and Chinese is included at no cost.

📖 Further reading: Case Study: Indian HDI Manufacturer Scaling Microvia Production · HDI & Micro-Via Drilling Material Selection Guide · Glossary: HDI definition →

FAQ

Q: Which backup for 1-step HDI at Ø0.12 mm? A: UV Melamine 950 is our recommended default; 880 is the workhorse for standard HDI. Move to 950 when the core is thinner than 0.10 mm or the stack is above 10 L.

Q: Can coated aluminum replace a pure lubricant film? A: Yes. Our thermoset 220°C coated sheet carries the lubricant and the entry stiffness in one piece, which is why it is a direct Coated alternative.

Q: Do you supply IC substrate grades? A: Phenolic PHE is built for IC substrate drilling below Ø0.10 mm and is available on request. For most lines we recommend UV Melamine 950 as the default backup.

Build Your HDI & IC Substrate Material Set

Send your layer count, smallest hole and current material. We return a matched grade set, samples and a side-by-side comparison — usually within one business day.

Talk to Mr. Lucky Xu →