Short answer: CO2 lasers (9.4/10.6 um infrared) are absorbed by the organic dielectric but reflected by copper, so you either pre-etch a copper window or use a conformal mask; the underlying copper acts as a natural stop for blind vias. Use CO2 for HDI blind vias down to about 75 um at 500-3000 holes/s, and keep mechanical drilling for larger through-holes.
Number: CO2 lasers run at 9.4 or 10.6 um; because copper reflects IR, the process needs a pre-etched copper window or conformal mask, with the copper plane as a natural stop. Typical output is 500-3000 holes/s, minimum about 75 um, taper 10-20 percent and HAZ 10-25 um; equipment cost is lower than UV laser (atlaspcb, fastturnpcbs).
Boundary: A laser drills the dielectric; the entry/backup board question barely applies to pure laser ablation, but the copper window definition and stack flatness still matter. Laser and mechanical are complementary, not competing — most HDI stacks use both.

CO2 laser drilling is the workhorse for HDI blind vias: fast, mature and cheap relative to UV. But it only removes the organic dielectric — copper bounces the beam back — so the process is really about where you let the laser land.
The 9.4/10.6 um CO2 wavelength is absorbed by the resin/glass dielectric but reflected by copper. That is both a limitation and a feature:
| Metric | Typical |
|---|---|
| Wavelength | 9.4 / 10.6 um (IR) |
| Throughput | 500-3000 holes/s |
| Minimum aperture | about 75 um |
| Taper | 10-20 percent |
| HAZ | 10-25 um |
| Equipment cost | Lower than UV laser |
Where the material set still matters: a flat, clean stack and well-defined copper window keep the via centered and the stop reliable. For finer, copper-direct features see the UV laser microvia page and the CO2 vs UV selection matrix.
YUESHAN supplies the flat, clean stacks used for HDI blind-via laser drilling. The questions below cover how CO2 lasers work, the copper-window requirement and where mechanical drilling wins.
CO2 at 9.4/10.6 um is absorbed by the organic dielectric but reflected by copper, so you pre-etch a copper window or use a conformal mask; the copper plane below acts as a natural stop (atlaspcb, fastturnpcbs).
About 75 um, at 500-3000 holes/s, with 10-20 percent taper and 10-25 um HAZ; equipment cost is lower than UV laser (atlaspcb, fastturnpcbs).
Yes — because copper reflects infrared, the dielectric must be exposed via pre-etch or conformal mask; the underlying copper then stops the via at the next layer.
For HDI blind vias below mechanical limits, CO2 is faster and cheaper; larger through-holes stay mechanical. The two are complementary in a real stack.
The board question barely applies to pure ablation, but a flat stack and well-defined copper window keep the via centered and the natural stop reliable.
YUESHAN supplies the aluminum entry and backup that keep HDI stacks flat; the laser tool is selected by the fabricator. Request a sample.